JPH0744025Y2 - リードの半田メッキ装置 - Google Patents
リードの半田メッキ装置Info
- Publication number
- JPH0744025Y2 JPH0744025Y2 JP1990119689U JP11968990U JPH0744025Y2 JP H0744025 Y2 JPH0744025 Y2 JP H0744025Y2 JP 1990119689 U JP1990119689 U JP 1990119689U JP 11968990 U JP11968990 U JP 11968990U JP H0744025 Y2 JPH0744025 Y2 JP H0744025Y2
- Authority
- JP
- Japan
- Prior art keywords
- solder plating
- leads
- lead
- cathode
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 title claims description 47
- 229910000679 solder Inorganic materials 0.000 title claims description 40
- 239000004065 semiconductor Substances 0.000 claims description 27
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 8
- 239000007788 liquid Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990119689U JPH0744025Y2 (ja) | 1990-11-15 | 1990-11-15 | リードの半田メッキ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990119689U JPH0744025Y2 (ja) | 1990-11-15 | 1990-11-15 | リードの半田メッキ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0476052U JPH0476052U (en]) | 1992-07-02 |
| JPH0744025Y2 true JPH0744025Y2 (ja) | 1995-10-09 |
Family
ID=31867632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990119689U Expired - Lifetime JPH0744025Y2 (ja) | 1990-11-15 | 1990-11-15 | リードの半田メッキ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0744025Y2 (en]) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63263752A (ja) * | 1987-04-22 | 1988-10-31 | Nec Corp | 高速部分めつき装置 |
| JPH02111898A (ja) * | 1988-10-20 | 1990-04-24 | Mitsubishi Electric Corp | 半導体素子の製造装置 |
-
1990
- 1990-11-15 JP JP1990119689U patent/JPH0744025Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0476052U (en]) | 1992-07-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |